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Technical Details

  • Series:Proto-Advantage
  • Package:Bulk
  • Part Status:Active
  • Proto Board Type:SMD to DIP
  • Package Accepted:MiniSOIC EP

 

  • Number of Positions:8
  • Pitch:0.026" (0.65mm)
  • Board Thickness:0.062" (1.57mm) 1/16"
  • Material:FR4 Epoxy Glass
  • Size / Dimension:0.700" x 0.400" (17.78mm x 10.16mm)

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