TS391LT250
Chip Quik, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionTHERMALLY STABLE SOLDER PASTE NO
- CategorySolder
- Datasheet TS391LT250 Datasheet
-
ECAD Model
- Share
In Stock: 161
Can ship immediately
Pricing:
- 1$84.95
Quote It
Technical Details
- Series:-
- Package:Bulk
- Part Status:Active
- Type:Solder Paste
- Composition:Bi57.6Sn42Ag0.4 (57.6/42/0.4)
- Diameter:-
- Melting Point:281°F (138°C)
- Flux Type:No-Clean
- Wire Gauge:-
- Process:Lead Free
- Form:Jar, 8.8 oz (250g)
- Shelf Life:12 Months
- Shelf Life Start:Date of Manufacture
- Storage/Refrigeration Temperature:68°F ~ 77°F (20°C ~ 25°C)
Related Products
LF SOLDER WIRE MINI POCKET PACK
- 1: $2.69000
LF SOLDER WIRE MINI POCKET PACK
- 1: $2.77000
SOLDER WIRE MINI POCKET PACK 60/
- 1: $3.10000
SOLDER WIRE POCKET PACK 63/37 TI
- 1: $4.45000
SOLDER WIRE 63/37 TIN/LEAD ROSIN
- 1: $4.51000