TS391SNL250
Chip Quik, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionTHERMALLY STABLE SOLDER PASTE NO
- CategorySolder
- Datasheet TS391SNL250 Datasheet
-
ECAD Model
- Share
In Stock: 165
Can ship immediately
Pricing:
- 1$69.95
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Technical Details
- Series:-
- Package:Bulk
- Part Status:Active
- Type:Solder Paste
- Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter:-
- Melting Point:423 ~ 428°F (217 ~ 220°C)
- Flux Type:No-Clean
- Wire Gauge:-
- Process:Lead Free
- Form:Jar, 8.8 oz (250g)
- Shelf Life:12 Months
- Shelf Life Start:Date of Manufacture
- Storage/Refrigeration Temperature:68°F ~ 77°F (20°C ~ 25°C)
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