SMD291SNL60T4 Chip Quik, Inc.

Technical Details

Series:-
Package:Jar
Part Status:Active
Type:Solder Paste, Two Part Mix
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423 ~ 428°F (217 ~ 220°C)

Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Jar, 2.12 oz (60g)
Shelf Life:24 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:37°F ~ 77°F (3°C ~ 25°C)

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SMD291SNL60T4

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Technical Details

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