57-3343-8109

Kester
  • Lifecycle status Active
  • RoHS RoHS Compliant
  • DescriptionSOLDER 500G JAR,SN96.5 AG3.0
  • CategorySolder
  • ECAD Model
  • Share
In Stock: 135

Can ship immediately

Pricing:

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Technical Details

  • Series:-
  • Package:Jar
  • Part Status:Obsolete
  • Type:Solder Paste
  • Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
  • Diameter:-
  • Melting Point:423 ~ 424°F (217 ~ 218°C)

 

  • Flux Type:-
  • Wire Gauge:-
  • Process:Lead Free
  • Form:Jar, 17.64 oz (500g)
  • Shelf Life:-
  • Shelf Life Start:-
  • Storage/Refrigeration Temperature:-

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