M2S090S-1FG676I

Microsemi
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Technical Details

  • Series:SmartFusion®2
  • Package:Tray
  • Part Status:Obsolete
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:512KB
  • RAM Size:64KB

 

  • Peripherals:DDR, PCIe, SERDES
  • Connectivity:CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed:166MHz
  • Primary Attributes:FPGA - 90K Logic Modules
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:676-BGA
  • Supplier Device Package:676-FBGA (27x27)

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