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Technical Details

  • Series:Tsi308™
  • Package:Tray
  • Part Status:Obsolete
  • Applications:HyperTransport-to-PCI Bridge
  • Interface:PCI

 

  • Voltage - Supply:1.8V
  • Package / Case:388-BGA Exposed Pad
  • Supplier Device Package:388-TEPBGA (27x27)
  • Mounting Type:Surface Mount

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