69-11-42339-T777

Parker Chomerics
In Stock: 349

Can ship immediately

Pricing:
  • 1$8.44
  • 10$8.208
  • 25$7.752
  • 50$7.296
  • 100$6.84
  • 250$6.384
  • 500$5.928
  • 1,000$5.814

Quote It

Technical Details

  • Series:THERMFLOW® T777
  • Package:Strip
  • Part Status:Active
  • Usage:-
  • Type:Gap Filler Pad, Sheet
  • Shape:Square
  • Outline:28.00mm x 28.00mm

 

  • Thickness:0.0045" (0.115mm)
  • Material:Polymer Solder Hybrid
  • Adhesive:Tacky - Both Sides
  • Backing, Carrier:-
  • Color:Gray
  • Thermal Resistivity:-
  • Thermal Conductivity:-

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