DILB18P-223TLF
Storage & Server IO (Amphenol ICC)
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 18POS TINLEAD
- CategorySockets for ICs, Transistors
- Datasheet DILB18P-223TLF Datasheet
-
ECAD Model
- Share
In Stock: 6,253
Can ship immediately
Pricing:
- 1$0.35
- 10$0.3341
- 26$0.28596
- 52$0.24313
- 104$0.23365
- 260$0.20975
- 520$0.20023
- 1,014$0.16687
- 2,522$0.15256
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Technical Details
- Series:DILB
- Package:Tube
- Part Status:Active
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):18 (2 x 9)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Tin-Lead
- Contact Finish Thickness - Mating:100.0µin (2.54µm)
- Contact Material - Mating:Copper Alloy
- Mounting Type:Through Hole
- Features:Open Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin-Lead
- Contact Finish Thickness - Post:100.0µin (2.54µm)
- Contact Material - Post:Copper Alloy
- Housing Material:Polyamide (PA), Nylon
- Operating Temperature:-55°C ~ 125°C
