DILB32P-223TLF
Storage & Server IO (Amphenol ICC)
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 32POS TINLEAD
- CategorySockets for ICs, Transistors
- Datasheet DILB32P-223TLF Datasheet
-
ECAD Model
- Share
In Stock: 3,325
Can ship immediately
Pricing:
- 1$0.5
- 10$0.46458
- 25$0.41834
- 50$0.37208
- 100$0.35646
- 250$0.3255
- 500$0.31
- 1,000$0.25574
- 2,500$0.2325
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Technical Details
- Series:DILB
- Package:Tube
- Part Status:Active
- Type:DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid):32 (2 x 16)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Tin-Lead
- Contact Finish Thickness - Mating:100.0µin (2.54µm)
- Contact Material - Mating:Copper Alloy
- Mounting Type:Through Hole
- Features:Open Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin-Lead
- Contact Finish Thickness - Post:100.0µin (2.54µm)
- Contact Material - Post:Copper Alloy
- Housing Material:Polyamide (PA), Nylon
- Operating Temperature:-55°C ~ 125°C
