23-0518-00

Technical Details

• Series:518
• Package:Bulk
• Part Status:Active
• Type:SIP
• Number of Positions or Pins (Grid):23 (1 x 23)
• Pitch - Mating:0.100" (2.54mm)
• Contact Finish - Mating:Gold
• Contact Finish Thickness - Mating:10.0µin (0.25µm)
• Contact Material - Mating:Beryllium Copper

• Mounting Type:Surface Mount
• Features:Open Frame
• Termination:Solder
• Pitch - Post:0.100" (2.54mm)
• Contact Finish - Post:Tin
• Contact Finish Thickness - Post:200.0µin (5.08µm)
• Contact Material - Post:Brass
• Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
• Operating Temperature:-