18-3501-30
Aries Electronics, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 18POS TIN
- CategorySockets for ICs, Transistors
- Datasheet 18-3501-30 Datasheet
-
ECAD Model
- Share
In Stock: 184
Can ship immediately
Pricing:
- 1$5.78381
- 21$5.78381
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Technical Details
- Series:501
- Package:Bulk
- Part Status:Active
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):18 (2 x 9)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Tin
- Contact Finish Thickness - Mating:200.0µin (5.08µm)
- Contact Material - Mating:Phosphor Bronze
- Mounting Type:Through Hole
- Features:Closed Frame
- Termination:Wire Wrap
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:200.0µin (5.08µm)
- Contact Material - Post:Phosphor Bronze
- Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature:-55°C ~ 125°C
