11-0503-31

Technical Details

• Series:0503
• Package:Bulk
• Part Status:Active
• Type:SIP
• Number of Positions or Pins (Grid):11 (1 x 11)
• Pitch - Mating:0.100" (2.54mm)
• Contact Finish - Mating:Gold
• Contact Finish Thickness - Mating:30.0µin (0.76µm)
• Contact Material - Mating:Beryllium Copper

• Mounting Type:Through Hole
• Features:-
• Termination:Wire Wrap
• Pitch - Post:0.100" (2.54mm)
• Contact Finish - Post:Gold
• Contact Finish Thickness - Post:10.0µin (0.25µm)
• Contact Material - Post:Brass
• Housing Material:Polyamide (PA), Nylon, Glass Filled
• Operating Temperature:-