18-3508-30
Aries Electronics, Inc.- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 18POS GOLD
- CategorySockets for ICs, Transistors
- Datasheet 18-3508-30 Datasheet
-
ECAD Model
- Share
In Stock: 140
Can ship immediately
Pricing:
- 1$8.71231
- 13$8.71231
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Technical Details
- Series:508
- Package:Bulk
- Part Status:Active
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):18 (2 x 9)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:30.0µin (0.76µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Open Frame
- Termination:Wire Wrap
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:200.0µin (5.08µm)
- Contact Material - Post:Brass
- Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature:-55°C ~ 105°C
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