24-526-11
Aries Electronics, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET ZIF 24POS GLD
- CategorySockets for ICs, Transistors
- Datasheet 24-526-11 Datasheet
-
ECAD Model
- Share
In Stock: 143
Can ship immediately
Pricing:
- 1$14.68
- 17$13.57882
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Technical Details
- Series:Lo-PRO®file, 526
- Package:Bulk
- Part Status:Active
- Type:DIP, ZIF (ZIP)
- Number of Positions or Pins (Grid):24 (2 x 12)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:10.0µin (0.25µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Closed Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Gold
- Contact Finish Thickness - Post:10.0µin (0.25µm)
- Contact Material - Post:Beryllium Copper
- Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature:-55°C ~ 125°C