26-8900-310C
Aries Electronics, Inc.- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 26POS GOLD
- CategorySockets for ICs, Transistors
- Datasheet 26-8900-310C Datasheet
-
ECAD Model
- Share
In Stock: 184
Can ship immediately
Pricing:
- 1$15.2025
- 8$13.82
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Technical Details
- Series:8
- Package:Bulk
- Part Status:Active
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):26 (2 x 13)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:30.0µin (0.76µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Closed Frame, Elevated
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Gold
- Contact Finish Thickness - Post:10.0µin (0.25µm)
- Contact Material - Post:Brass
- Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature:-55°C ~ 105°C
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