30-81250-610C
Aries Electronics, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 30POS GOLD
- CategorySockets for ICs, Transistors
- Datasheet 30-81250-610C Datasheet
-
ECAD Model
- Share
In Stock: 174
Can ship immediately
Pricing:
- 1$16.56857
- 7$13.41286
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Technical Details
- Series:8
- Package:Bulk
- Part Status:Active
- Type:DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid):30 (2 x 15)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:30.0µin (0.76µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Closed Frame, Elevated
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Gold
- Contact Finish Thickness - Post:10.0µin (0.25µm)
- Contact Material - Post:Brass
- Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature:-55°C ~ 105°C