28-3573-11

Technical Details

• Series:57
• Package:Bulk
• Part Status:Active
• Type:DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
• Number of Positions or Pins (Grid):28 (2 x 14)
• Pitch - Mating:0.100" (2.54mm)
• Contact Finish - Mating:Gold
• Contact Finish Thickness - Mating:10.0µin (0.25µm)
• Contact Material - Mating:Beryllium Copper

• Mounting Type:Through Hole
• Features:Closed Frame
• Termination:Solder
• Pitch - Post:0.100" (2.54mm)
• Contact Finish - Post:Gold
• Contact Finish Thickness - Post:10.0µin (0.25µm)
• Contact Material - Post:Beryllium Copper
• Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
• Operating Temperature:-