550-10-352M26-001166

Preci-Dip
In Stock: 108

Can ship immediately

Pricing:
  • 1$23.25452
  • 14$23.25452

Quote It

Technical Details

  • Series:550
  • Package:Bulk
  • Part Status:Active
  • Type:BGA
  • Number of Positions or Pins (Grid):352 (26 x 26)
  • Pitch - Mating:0.050" (1.27mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:10.0µin (0.25µm)
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.050" (1.27mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:10.0µin (0.25µm)
  • Contact Material - Post:Brass
  • Housing Material:FR4 Epoxy Glass
  • Operating Temperature:-55°C ~ 125°C

Related Products


32-6508-211

CONN IC DIP SOCKET 32POS GOLD

32-6508-211 Datasheet
  • 1: $23.27250
  • 4: $18.87000

32-6508-311

CONN IC DIP SOCKET 32POS GOLD

32-6508-311 Datasheet
  • 1: $23.27250
  • 4: $18.87000

614-13-114-13-061001
  • 1: $23.28460
  • 50: $23.28460

614-13-114-13-061007
  • 1: $23.28460
  • 50: $23.28460

614-13-114-13-061012
  • 1: $23.28460
  • 50: $23.28460

614-13-114-13-062001
  • 1: $23.28460
  • 50: $23.28460

614-13-114-13-062007
  • 1: $23.28460
  • 50: $23.28460

614-13-114-13-062012
  • 1: $23.28460
  • 50: $23.28460

614-13-114-15-063001
  • 1: $23.28460
  • 50: $23.28460

614-13-114-15-063007
  • 1: $23.28460
  • 50: $23.28460

Top