514-83-360M19-001148
Preci-Dip
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN SOCKET BGA 360POS GOLD
- CategorySockets for ICs, Transistors
- Datasheet 514-83-360M19-001148 Datasheet
-
ECAD Model
- Share
In Stock: 140
Can ship immediately
Pricing:
- 1$32.123
- 21$32.123
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Technical Details
- Series:514
- Package:Bulk
- Part Status:Active
- Type:BGA
- Number of Positions or Pins (Grid):360 (19 x 19)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:29.5µin (0.75µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Surface Mount
- Features:Open Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:-
- Contact Material - Post:Brass
- Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Operating Temperature:-55°C ~ 125°C