32-6554-16
Aries Electronics, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET ZIF 32POS
- CategorySockets for ICs, Transistors
- Datasheet 32-6554-16 Datasheet
-
ECAD Model
- Share
In Stock: 130
Can ship immediately
Pricing:
- 1$35.96375
- 8$29.16
Quote It
Technical Details
- Series:55
- Package:Bulk
- Part Status:Active
- Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid):32 (2 x 16)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Nickel Boron
- Contact Finish Thickness - Mating:50.0µin (1.27µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Closed Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Nickel Boron
- Contact Finish Thickness - Post:50.0µin (1.27µm)
- Contact Material - Post:Beryllium Copper
- Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature:-