558-10-357M19-001104
Preci-Dip
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionBGA SURFACE MOUNT 1.27MM
- CategorySockets for ICs, Transistors
- Datasheet 558-10-357M19-001104 Datasheet
-
ECAD Model
- Share
In Stock: 159
Can ship immediately
Pricing:
- 1$36.08618
- 21$36.08618
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Technical Details
- Series:558
- Package:Bulk
- Part Status:Active
- Type:BGA
- Number of Positions or Pins (Grid):357 (19 x 19)
- Pitch - Mating:0.050" (1.27mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:10.0µin (0.25µm)
- Contact Material - Mating:Brass
- Mounting Type:Surface Mount
- Features:Closed Frame
- Termination:Solder
- Pitch - Post:0.050" (1.27mm)
- Contact Finish - Post:Gold
- Contact Finish Thickness - Post:10.0µin (0.25µm)
- Contact Material - Post:Brass
- Housing Material:FR4 Epoxy Glass
- Operating Temperature:-55°C ~ 125°C