180-PLS18007-12
Aries Electronics, Inc.- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN SOCKET PGA ZIF GOLD
- CategorySockets for ICs, Transistors
- Datasheet 180-PLS18007-12 Datasheet
-
ECAD Model
- Share
In Stock: 164
Can ship immediately
Pricing:
- 1$90.39
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Technical Details
- Series:PLS
- Package:Bulk
- Part Status:Active
- Type:PGA, ZIF (ZIP)
- Number of Positions or Pins (Grid):-
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:30.0µin (0.76µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Closed Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:200.0µin (5.08µm)
- Contact Material - Post:Beryllium Copper
- Housing Material:Polyphenylene Sulfide (PPS)
- Operating Temperature:-65°C ~ 125°C
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