32-6574-18
Aries Electronics, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET ZIF 32POS TIN
- CategorySockets for ICs, Transistors
- Datasheet 32-6574-18 Datasheet
-
ECAD Model
- Share
In Stock: 114
Can ship immediately
Pricing:
- 1$105.264
- 10$88.817
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Technical Details
- Series:57
- Package:Bulk
- Part Status:Active
- Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid):32 (2 x 16)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Tin
- Contact Finish Thickness - Mating:200.0µin (5.08µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Closed Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:200.0µin (5.08µm)
- Contact Material - Post:Beryllium Copper
- Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature:-