40-516-10
Aries Electronics, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET ZIF 40POS TIN
- CategorySockets for ICs, Transistors
- Datasheet 40-516-10 Datasheet
-
ECAD Model
- Share
In Stock: 160
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Pricing:
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Technical Details
- Series:516
- Package:Bulk
- Part Status:Obsolete
- Type:DIP, ZIF (ZIP)
- Number of Positions or Pins (Grid):40 (2 x 20)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Tin
- Contact Finish Thickness - Mating:10.0µin (0.25µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Closed Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:10.0µin (0.25µm)
- Contact Material - Post:Beryllium Copper
- Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature:-
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