In Stock: 143

Can ship immediately

Pricing:

Call for price or sumbit a RFQ

Quote It

Technical Details

  • Series:Diplomate DL
  • Package:-
  • Part Status:Obsolete
  • Type:DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid):16 (2 x 8)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:30.0µin (0.76µm)
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:Open Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:30.0µin (0.76µm)
  • Contact Material - Post:Beryllium Copper
  • Housing Material:-
  • Operating Temperature:-

Related Products


210748-5

CONN SOCKET PGA 6POS TIN-LEAD

210748-5 Datasheet

Call for price


3-1437504-6

CONN TRANSIST TO-3 3POS GOLD

3-1437504-6 Datasheet

Call for price


3-1437508-9

CONN TRANSIST TO-5 8POS GOLD

Call for price


3-1437530-2

CONN SOCKET SIP 15POS

3-1437530-2 Datasheet

Call for price


3-1437531-7

CONN IC DIP SOCKET 14POS

3-1437531-7 Datasheet

Call for price


3-1437532-4

CONN IC DIP SOCKET 28POS GOLD

3-1437532-4 Datasheet

Call for price


3-1437537-0

CONN IC DIP SOCKET 14POS TINLEAD

3-1437537-0 Datasheet

Call for price


3-1437537-5

CONN IC DIP SOCKET 14POS GOLD

3-1437537-5 Datasheet

Call for price


347846-3

CONN IC DIP SOCKET 28POS TINLEAD

Call for price


390263-7

CONN IC DIP SOCKET 24POS TINLEAD

390263-7 Datasheet

Call for price


Top