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Technical Details

  • Series:500
  • Package:Bulk
  • Part Status:Active
  • Type:DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid):40 (2 x 20)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Tin-Lead
  • Contact Finish Thickness - Mating:-
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Tin-Lead
  • Contact Finish Thickness - Post:-
  • Contact Material - Post:Beryllium Copper
  • Housing Material:Polyester
  • Operating Temperature:-55°C ~ 105°C

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