130-028-050
3M- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 28POS GOLD
- CategorySockets for ICs, Transistors
- Datasheet 130-028-050 Datasheet
-
ECAD Model
- Share
In Stock: 198
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Technical Details
- Series:100
- Package:Bulk
- Part Status:Obsolete
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):28 (2 x 14)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:8.00µin (0.203µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Open Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Gold
- Contact Finish Thickness - Post:Flash
- Contact Material - Post:Brass
- Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature:-65°C ~ 125°C
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