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Technical Details

  • Series:-
  • Package:Bulk
  • Part Status:Obsolete
  • Type:SIP
  • Number of Positions or Pins (Grid):64 (1 x 64)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:29.5µin (0.75µm)
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:29.5µin (0.75µm)
  • Contact Material - Post:Brass
  • Housing Material:Thermoplastic, Polyester
  • Operating Temperature:-55°C ~ 125°C

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