4-1814655-1

Technical Details

• Series:-
• Package:Bulk
• Part Status:Obsolete
• Type:SIP
• Number of Positions or Pins (Grid):64 (1 x 64)
• Pitch - Mating:0.100" (2.54mm)
• Contact Finish - Mating:Gold
• Contact Finish Thickness - Mating:29.5µin (0.75µm)
• Contact Material - Mating:Beryllium Copper

• Mounting Type:Through Hole
• Features:Closed Frame
• Termination:Solder
• Pitch - Post:0.100" (2.54mm)
• Contact Finish - Post:Gold
• Contact Finish Thickness - Post:29.5µin (0.75µm)
• Contact Material - Post:Brass
• Housing Material:Thermoplastic, Polyester
• Operating Temperature:-55°C ~ 125°C