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Technical Details

  • Series:-
  • Package:Tray
  • Part Status:Obsolete
  • Type:PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid):370 (19 x 19)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:30.0µin (0.76µm)
  • Contact Material - Mating:Copper Alloy

 

  • Mounting Type:Through Hole
  • Features:Open Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:30.0µin (0.76µm)
  • Contact Material - Post:Copper Alloy
  • Housing Material:Liquid Crystal Polymer (LCP)
  • Operating Temperature:-

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