HIC-764-SST

Samtec, Inc.
In Stock: 116

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Technical Details

  • Series:HIC
  • Package:Tube
  • Part Status:Active
  • Type:DIP, 0.75" (19.05mm) Row Spacing
  • Number of Positions or Pins (Grid):64 (2 x 32)
  • Pitch - Mating:0.070" (1.78mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:10.0µin (0.25µm)
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:Open Frame
  • Termination:Solder
  • Pitch - Post:0.070" (1.78mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:200.0µin (5.08µm)
  • Contact Material - Post:Brass
  • Housing Material:Polyester, Glass Filled
  • Operating Temperature:-

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