IC-316-SGG
Samtec, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 16POS GOLD
- CategorySockets for ICs, Transistors
- Datasheet IC-316-SGG Datasheet
-
ECAD Model
- Share
In Stock: 187
Can ship immediately
Pricing:
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Technical Details
- Series:IC
- Package:Bulk
- Part Status:Obsolete
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):16 (2 x 8)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:30.0µin (0.76µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Open Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Gold
- Contact Finish Thickness - Post:30.0µin (0.76µm)
- Contact Material - Post:Phosphor Bronze
- Housing Material:Polyester, Glass Filled
- Operating Temperature:-55°C ~ 125°C
