D0816-01
Harwin
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 16POS GOLD
- CategorySockets for ICs, Transistors
- Datasheet D0816-01 Datasheet
-
ECAD Model
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In Stock: 194
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Technical Details
- Series:D0
- Package:Bulk
- Part Status:Obsolete
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):16 (2 x 8)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:10.0µin (0.25µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Open Frame
- Termination:Wire Wrap
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:196.9µin (5.00µm)
- Contact Material - Post:Brass
- Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
- Operating Temperature:-55°C ~ 125°C