In Stock: 134

Can ship immediately

Pricing:

Call for price or sumbit a RFQ

Quote It

Technical Details

  • Series:-
  • Package:Tray
  • Part Status:Obsolete
  • Type:LGA
  • Number of Positions or Pins (Grid):1944 (G34)
  • Pitch - Mating:0.039" (1.00mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:30.0µin (0.76µm)
  • Contact Material - Mating:Copper Alloy

 

  • Mounting Type:Surface Mount
  • Features:Open Frame
  • Termination:Solder
  • Pitch - Post:0.039" (1.00mm)
  • Contact Finish - Post:-
  • Contact Finish Thickness - Post:-
  • Contact Material - Post:-
  • Housing Material:Liquid Crystal Polymer (LCP)
  • Operating Temperature:-

Related Products


2-382189-2

CONN IC DIP SOCKET 32POS GOLD

2-382189-2 Datasheet

Call for price


2-382468-4

CONN IC DIP SOCKET 40POS GOLD

2-382468-4 Datasheet

Call for price


2-641262-4

CONN IC DIP SOCKET 16POS GOLD

2-641262-4 Datasheet

Call for price


2-641599-4

CONN IC DIP SOCKET 14POS GOLD

2-641599-4 Datasheet

Call for price


2-641604-4

CONN IC DIP SOCKET 24POS GOLD

2-641604-4 Datasheet

Call for price


2-641610-4

CONN IC DIP SOCKET 16POS GOLD

2-641610-4 Datasheet

Call for price


808-AG12D

CONN IC DIP SOCKET 8POS TIN-LEAD

808-AG12D Datasheet

Call for price


808-AG12SM

CONN IC DIP SOCKET 8POS TIN-LEAD

808-AG12SM Datasheet

Call for price


816-AG12D-ES

CONN IC DIP SOCKET 16POS TINLEAD

816-AG12D-ES Datasheet

Call for price


1-1437538-3

CONN IC DIP SOCKET 28POS TINLEAD

1-1437538-3 Datasheet

Call for price


Top