22-4501-30
Aries Electronics, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 22POS TIN
- CategorySockets for ICs, Transistors
- Datasheet 22-4501-30 Datasheet
-
ECAD Model
- Share
In Stock: 105
Can ship immediately
Pricing:
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Technical Details
- Series:501
- Package:Bulk
- Part Status:Obsolete
- Type:DIP, 0.4" (10.16mm) Row Spacing
- Number of Positions or Pins (Grid):22 (2 x 11)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Tin
- Contact Finish Thickness - Mating:200.0µin (5.08µm)
- Contact Material - Mating:Phosphor Bronze
- Mounting Type:Through Hole
- Features:Closed Frame
- Termination:Wire Wrap
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:200.0µin (5.08µm)
- Contact Material - Post:Phosphor Bronze
- Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature:-55°C ~ 125°C