818-AG11SM
TE Connectivity AMP Connectors- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 18POS GOLD
- CategorySockets for ICs, Transistors
-
ECAD Model
- Share
In Stock: 168
Can ship immediately
Pricing:
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Technical Details
- Series:800
- Package:Bulk
- Part Status:Active
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Number of Positions or Pins (Grid):18 (2 x 9)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:-
- Contact Material - Mating:Copper Alloy
- Mounting Type:Surface Mount
- Features:Open Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin-Lead
- Contact Finish Thickness - Post:-
- Contact Material - Post:Copper Alloy
- Housing Material:Thermoplastic, Polyester
- Operating Temperature:-
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