8-1437529-1

Technical Details

• Series:500
• Package:Bulk
• Part Status:Active
• Type:DIP, 0.4" (10.16mm) Row Spacing
• Number of Positions or Pins (Grid):8 (2 x 4)
• Pitch - Mating:0.100" (2.54mm)
• Contact Finish - Mating:Gold
• Contact Finish Thickness - Mating:20.0µin (0.51µm)
• Contact Material - Mating:Beryllium Copper

• Mounting Type:Through Hole
• Features:Closed Frame
• Termination:Solder
• Pitch - Post:0.100" (2.54mm)
• Contact Finish - Post:Gold
• Contact Finish Thickness - Post:47.2µin (1.20µm)
• Contact Material - Post:Copper Alloy
• Housing Material:Thermoplastic, Polyester
• Operating Temperature:-55°C ~ 105°C