DF2117RVBG20IHV

Renesas Electronics America
In Stock: 130

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Technical Details

  • Series:H8® H8S/2100
  • Package:Tray
  • Part Status:Active
  • Core Processor:H8S/2600
  • Core Size:16-Bit
  • Speed:20MHz
  • Connectivity:FIFO, I²C, LPC, SCI, SmartCard
  • Peripherals:POR, PWM, WDT
  • Number of I/O:128
  • Program Memory Size:160KB (160K x 8)

 

  • Program Memory Type:FLASH
  • EEPROM Size:-
  • RAM Size:8K x 8
  • Voltage - Supply (Vcc/Vdd):3V ~ 3.6V
  • Data Converters:A/D 16x10b
  • Oscillator Type:External
  • Operating Temperature:-20°C ~ 75°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:176-LFBGA
  • Supplier Device Package:176-LFBGA (13x13)

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