R7F701406EABG-C#HC1

Technical Details

• Series:RH850/D1x
• Package:Tray
• Part Status:Active
• Core Processor:RH850G3M
• Core Size:32-Bit
• Speed:200MHz
• Connectivity:CANbus, CSI, I²C, LINbus, SPI, UART/USART
• Peripherals:DMA, PWM, WDT
• Number of I/O:126
• Program Memory Size:3.75MB (3.75M x 8)

• Program Memory Type:FLASH
• EEPROM Size:64K x 8
• RAM Size:512K x 8
• Voltage - Supply (Vcc/Vdd):2.7V ~ 5.5V
• Data Converters:A/D 16x12b
• Oscillator Type:Internal
• Operating Temperature:-40°C ~ 150°C (TJ)
• Mounting Type:Surface Mount
• Package / Case:272-BGA
• Supplier Device Package:272-BGA (21x21)