BDN09-3CB/A01
CTS Corporation
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionHEATSINK CPU W/ADHESIVE .91"SQ
- CategoryThermal - Heat Sinks
- Datasheet BDN09-3CB/A01 Datasheet
-
ECAD Model
- Share
In Stock: 936
Can ship immediately
Pricing:
- 1$2.38
- 10$2.31816
- 25$2.25519
- 50$2.12982
- 100$2.00454
- 250$1.87923
- 500$1.81658
- 1,000$1.62866
- 5,000$1.59734
Quote It
Technical Details
- Series:BDN
- Package:Box
- Part Status:Active
- Type:Top Mount
- Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method:Thermal Tape, Adhesive (Included)
- Shape:Square, Pin Fins
- Length:0.910" (23.11mm)
- Width:0.910" (23.11mm)
- Diameter:-
- Fin Height:0.355" (9.02mm)
- Power Dissipation @ Temperature Rise:-
- Thermal Resistance @ Forced Air Flow:9.60°C/W @ 400 LFM
- Thermal Resistance @ Natural:26.90°C/W
- Material:Aluminum
- Material Finish:Black Anodized
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