BDN11-3CB/A01
CTS Corporation
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionHEATSINK CPU W/ADHESIVE 1.11"SQ
- CategoryThermal - Heat Sinks
- Datasheet BDN11-3CB/A01 Datasheet
-
ECAD Model
- Share
In Stock: 3,375
Can ship immediately
Pricing:
- 1$2.56
- 10$2.49391
- 25$2.42655
- 50$2.29161
- 100$2.15691
- 250$2.02207
- 500$1.95467
- 1,000$1.75246
- 5,000$1.71874
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Technical Details
- Series:BDN
- Package:Box
- Part Status:Active
- Type:Top Mount
- Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method:Thermal Tape, Adhesive (Included)
- Shape:Square, Pin Fins
- Length:1.110" (28.19mm)
- Width:1.110" (28.19mm)
- Diameter:-
- Fin Height:0.355" (9.02mm)
- Power Dissipation @ Temperature Rise:-
- Thermal Resistance @ Forced Air Flow:7.20°C/W @ 400 LFM
- Thermal Resistance @ Natural:20.90°C/W
- Material:Aluminum
- Material Finish:Black Anodized
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