APF30-30-13CB
CTS Corporation
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionHEATSINK LOW-PROFILE FORGED
- CategoryThermal - Heat Sinks
- Datasheet APF30-30-13CB Datasheet
-
ECAD Model
- Share
In Stock: 544
Can ship immediately
Pricing:
- 1$5.79
- 10$5.6366
- 25$5.3238
- 50$5.01064
- 100$4.69748
- 250$4.38431
- 500$4.07115
- 1,000$3.99285
Quote It
Technical Details
- Series:APF
- Package:Box
- Part Status:Active
- Type:Top Mount
- Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method:Thermal Tape, Adhesive (Not Included)
- Shape:Square, Fins
- Length:1.181" (30.00mm)
- Width:1.181" (30.00mm)
- Diameter:-
- Fin Height:0.500" (12.70mm)
- Power Dissipation @ Temperature Rise:-
- Thermal Resistance @ Forced Air Flow:2.50°C/W @ 200 LFM
- Thermal Resistance @ Natural:-
- Material:Aluminum
- Material Finish:Black Anodized
Related Products
HEAT SINK FOR TI MOD #TAS5611PHD
- 1: $6.02000
