BDN15-3CB/A01
CTS Corporation
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionHEATSINK CPU W/ADHESIVE 1.51"SQ
- CategoryThermal - Heat Sinks
- Datasheet BDN15-3CB/A01 Datasheet
-
ECAD Model
- Share
In Stock: 183
Can ship immediately
Pricing:
- 1$2.1814
- 1,000$2.10319
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Technical Details
- Series:BDN
- Package:Box
- Part Status:Active
- Type:Top Mount
- Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method:Thermal Tape, Adhesive (Included)
- Shape:Square, Pin Fins
- Length:1.510" (38.35mm)
- Width:1.510" (38.35mm)
- Diameter:-
- Fin Height:0.355" (9.02mm)
- Power Dissipation @ Temperature Rise:-
- Thermal Resistance @ Forced Air Flow:4.50°C/W @ 400 LFM
- Thermal Resistance @ Natural:15.10°C/W
- Material:Aluminum
- Material Finish:Black Anodized
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