FI-XPB30SRL-HF11

JAE Electronics
In Stock: 134

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Technical Details

  • Series:FI-XP
  • Package:Tray
  • Part Status:Obsolete
  • Connector Type:Receptacle
  • Contact Type:Non-Gendered
  • Style:Board to Cable/Wire
  • Number of Positions:30
  • Number of Positions Loaded:All
  • Pitch - Mating:0.039" (1.00mm)
  • Number of Rows:1
  • Row Spacing - Mating:-
  • Mounting Type:Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount
  • Termination:Solder
  • Fastening Type:Friction Lock

 

  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:12.0µin (0.30µm)
  • Insulation Color:Black
  • Insulation Height:-
  • Contact Length - Post:-
  • Operating Temperature:-
  • Material Flammability Rating:UL94 V-0
  • Contact Finish - Post:Tin
  • Mated Stacking Heights:-
  • Ingress Protection:-
  • Features:Grounding Pins, Shielded, Solder Retention
  • Current Rating (Amps):-
  • Voltage Rating:-

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