In Stock: 195

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Technical Details

  • Series:500
  • Package:Bulk
  • Part Status:Active
  • Type:SIP
  • Number of Positions or Pins (Grid):12 (1 x 12)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:-
  • Contact Finish Thickness - Mating:-
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:-
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:-
  • Contact Finish Thickness - Post:-
  • Contact Material - Post:Beryllium Copper
  • Housing Material:Thermoplastic
  • Operating Temperature:-

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