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Technical Details

  • Series:-
  • Package:Bulk
  • Part Status:Active
  • Type:LGA
  • Number of Positions or Pins (Grid):1155 (40 x 40)
  • Pitch - Mating:0.036" (0.91mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:15.0µin (0.38µm)
  • Contact Material - Mating:Copper Alloy

 

  • Mounting Type:Surface Mount
  • Features:Open Frame
  • Termination:Solder
  • Pitch - Post:0.036" (0.91mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:15.0µin (0.38µm)
  • Contact Material - Post:Copper Alloy
  • Housing Material:Thermoplastic
  • Operating Temperature:-

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