In Stock: 142

Can ship immediately

Pricing:

Call for price or sumbit a RFQ

Quote It

Technical Details

  • Series:-
  • Package:Bulk
  • Part Status:Active
  • Type:Transistor, TO-3
  • Number of Positions or Pins (Grid):3 (Oval)
  • Pitch - Mating:-
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:50.0µin (1.27µm)
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:-
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:-
  • Contact Material - Post:Beryllium Copper
  • Housing Material:Diallyl Phthalate (DAP)
  • Operating Temperature:-55°C ~ 125°C

Related Products


8-1437532-6

CONN IC DIP SOCKET 28POS GOLD

8-1437532-6 Datasheet

Call for price


818-AG11SM

CONN IC DIP SOCKET 18POS GOLD

Call for price


820-AG12D

CONN IC DIP SOCKET 20POS GOLD

820-AG12D Datasheet

Call for price


824-AG66D

CONN IC DIP SOCKET 24POS GOLD

824-AG66D Datasheet

Call for price


9-1437508-1

CONN SOCKET TRANSIST TO-5

Call for price


9-1437508-2

CONN SOCKET TRANSIST TO-5

Call for price


9-1437520-0

STAMPED PIN

Call for price


9-1437520-1

CONN SOCKET PGA 168POS GOLD

Call for price


9-1437537-3

CONN IC DIP SOCKET 3POS GOLD

9-1437537-3 Datasheet

Call for price


8058-1G55

CONN SOCKET TRANSIST TO-5 20POS

Call for price


Top